# NOTE: # CAUTION!! The model is valid only with reasonable heatsink/fan parameters! # CAUTION!! This thermal package model is based on empirical convection heat transfer # theories in textbooks. Detailed FEM and/or actual measurements might be needed # to ensure the accuracy of those empirical formulas. # # In most cases, the package model should be turned off and the default lumped # convection thermal resistance r_convec should serve well for most purposes. # However, this feature of modeling thermal packaging details might be useful when: # 1) detailed heatsink and fan information is known, or, # 2) you are using HotSpot for thermal package design, or, # 3) detailed investigation of the impact of thermal package configs on silcion temperature is desired # package model parameters # heat sink specs # natural convection? 0: forced convection, 1: natural convection -natural_convec 0 # if not natural convection, then # flow type: 0) lateral airflow from sink side. 1) impinging airflow from sink top -flow_type 0 # heatsink type: 0) fin-channel sink, 1) pin-fin sink -sink_type 0 # (sink base size is defined in hotspot.config) # all in meters # 1) fin-channel sink -fin_height 0.03 # most CPU fin heights are only a couple of centimeters -fin_width 0.001 # uasually a few millimeters -channel_width 0.002 # usually a few millimeters # 2) pin-fin sink -pin_height 0.02 # similar value to fin height -pin_diam 0.002 # similar to greater than fin width -pin_dist 0.005 # similar to or greater than channel width # fan specs, in meters -fan_radius 0.03 # usually about half of heat sink size -motor_radius 0.01 # less than the fan radius, usually not a very small value -rpm 1000 # usually a few thousands
