# thermal model parameters
# chip specs
# chip thickness in meters (only used if LCF is not specified)
-t_chip 0.00015
# chip default material
#-material_chip silicon
# chip default thermal conductivity in W/(m-K) (overrided by default material)
-k_chip 130.0
# chip volumetric heat capacity in J/(m^3-K) (overrided by default material)
-p_chip 1630300
# heat sink specs
# heat sink material
#-material_sink aluminum
# convection capacitance in J/K
-c_convec 140.4
# convection resistance in K/W
-r_convec 1.042
# heatsink side in meters
-s_sink 0.06
# heatsink thickness in meters
-t_sink 0.0069
# heatsink thermal conductivity in W/(m-K) (overrided by heat sink material)
-k_sink 400.0
# heatsink volumetric heat capacity in J/(m^3-K) (overrided by heat sink material)
-p_sink 3.55e6
# heat spreader specs
# spreader material
#-material_spreader aluminum
# spreader side in meters
-s_spreader 0.03
# spreader thickness in meters
-t_spreader 0.001
# heat spreader thermal conductivity in W/(m-K) (overrided by spreader material)
-k_spreader 400.0
# heat spreader volumetric heat capacity in J/(m^3-K) (overrided by spreader material)
-p_spreader 3.55e6
# interface material specs
# interface material thickness in meters
-t_interface 2.0e-05
# interface material thermal conductivity in W/(m-K) (overrided by interface material)
-k_interface 4.0
# interface material volumetric heat capacity in J/(m^3-K) (overrided by interface material)
-p_interface 4.0e6
# secondary path (C4/underfill, package substrate, solder balls etc)
# ONLY AVAILABLE IN THE GRID MODEL WITHOUT MICROFLUIDIC COOLING
# model secondary path or not?
-model_secondary 0
# convection resistance at the air/PCB interface in K/W
-r_convec_sec 50.0
# convection capacitance at the air/PCB interface in J/K
-c_convec_sec 40.0
# number of on-chip metal layers
-n_metal 8
# one metal layer thickness in meters
-t_metal 100.0e-6
# C4/underfill thickness in meters
-t_c4 0.0001
# side size of EACH C4 pad
-s_c4 20.0e-6
# number of C4 pads
-n_c4 400
# package substrate side in meters
-s_sub 0.021
# package substrate thickness in meters
-t_sub 0.001
# solder ball side in meters
-s_solder 0.021
# solder ball thickness in meters
-t_solder 0.00094
# PCB side in meters
-s_pcb 0.1
# PCB thickness in meters
-t_pcb 0.002
# others
# ambient temperature in kelvin
-ambient 318.15
# initial temperatures from file
-init_file (null)
# initial temperature (kelvin) if not from file
-init_temp 318.15
# steady state temperatures to file
-steady_file (null)
# interval between power traces in seconds
-sampling_intvl 0.01
# base processor frequency in Hz
-base_proc_freq 3e+09
# is DTM employed?
-dtm_used 0
# model type - block or grid
-model_type block
# consider temperature-leakage loop within HotSpot?
-leakage_used 0
# leakage calculation modes: (only valid when -leakage_used=1)
# 0 user-defined leakage power model, do temp-leakage loop within HotSpot
# 1 use HotLeakage -- !NOT implemented in this release!, coming later.
-leakage_mode 0
# use detailed package model?
-package_model_used 0
-package_config_file package.config
# block model specific parameters
# omit lateral chip resistances?
-block_omit_lateral 0
# grid model specific parameters
# grid resolution - no. of rows
-grid_rows 39
# grid resolution - no. of cols
-grid_cols 39
# layer configuration from file
-grid_layer_file (null)
# dump internal grid steady state temperatures
-grid_steady_file (null)
# grid to block mapping mode - (avg|min|max|center)
# i.e., a block's temperature is the avg, min or max
# of all the grid cells in it or equal to that of
# the grid cell in its center
-grid_map_mode avg
# microfluidic cooling parameters
# using microfluidic cooling?
-use_microfluidic_cooling 0
# pumping pressure (Pa)
-pumping_pressure 52000
# Pump Internal Resistance (Pa-S/m^3)
-pump_internal_res 0
# temperature of coolant at inlet (K)
-inlet_temperature 298.15
# coolant material
-coolant_material water
# volumetric heat capacity of coolant (J/m^3-K) (overrided by coolant material)
# -coolant_capac 4172638
# resistivity of coolant (m-K/W) (overrided by coolant material)
# -coolant_res 1.647717911
# dynamic viscosity of coolant (Pa-s) (overrided by coolant material)
# -coolant_visc 8.89e-4
# channel wall material
-wall_material silicon
# volumetric heat capacity of channel walls (J/m^3-K) (overrided by wall material)
# -wall_capac 1630300
# resistivity of channel walls (m-K/W) (overrided by wall material)
# -wall_res 0.0076923077
# heat transfer coefficient (W/m^2-K)
-htc 27132
# floorplanner parameters
# L2 modeling
# wrap around L2?
-wrap_l2 1
# name of the L2 unit to look for
-l2_label L2
# rim modeling
# model dead space around the rim of the chip?
-model_rim 0
# thickness of the rim in meters
-rim_thickness 5e-05
# others
# area ratio below which to ignore dead space
-compact_ratio 0.005
# no. of discrete orientations for a shape curve (even no. > 1)
-n_orients 300
# annealing parameters
# initial acceptance probability
-P0 0.99
# average change (delta) in cost
-Davg 1
# no. of moves to try in each step
-Kmoves 7
# ratio for the cooling schedule
-Rcool 0.99
# ratio of rejects at which to stop annealing
-Rreject 0.99
# absolute max no. of annealing steps
-Nmax 1000
# weights for the metric: lambdaA * A + lambdaT * T + lambdaW * W
# weight for the area term
-lambdaA 5.0e+06
# weight for the temperature term
-lambdaT 1
# weight for the wire length term
-lambdaW 350
